IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.
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If all moisture absorption precautions are taken and connectors jjedec still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required.
Figures 1 and 2. Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason. If the document is revised or amended, you will be notified by email. This standard is not included in any packages. srd
Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors. Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, jedwc will melt, suffer pin retention failures or fail to meet dimensional stability requirements.
All techniques provided similar moisture percentages in parts. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing medec minimum shelf life of 12 months from the seal date when using sealed dry bags.
J-STD Bake Conditions
The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow. For ease of use, the halogen moisture analyzer was considered the best. Your Alert Profile lists the documents that will be monitored. Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process.
Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. You can download and open medec file to your own computer but DRM prevents opening this file on another computer, including a networked server.
The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts. You may 0333a a document from your Alert Profile at any time. The company compared three moisture measurement techniques: For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units.
Already Subscribed to this document. The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2. Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. Please first log in with a verified email before subscribing to alerts.
Subscription pricing is determined by: But the problems listed previously for connectors in these hot oven environments can also result in board rework. The higher the peak temperature, the lower the moisture content can be before blistering.
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Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector jedecc. We have no amendments or corrections for this standard. They were subjected to two different storage conditions: The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature.
The next phase will be lead-free solder compliance for board assembly. Approved options include clay and silica gel. Effectiveness of desiccant on moisture absorption of packaged connectors.
Proceed to Checkout Continue Shopping. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Please first verify your email before subscribing to alerts. BoxEvansville, IN; Fax: This standard is also available to be included in Standards Subscriptions.